HCS

TYPE	DESCRIPTION
Mfr	AMD Xilinx
Series	-
Package	Tray
Part Status	Active
Architecture	MPU, FPGA
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size	-
RAM Size	256KB
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	533MHz, 1.3GHz
Primary Attributes	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature	0°C ~ 100°C (TJ)
Package / Case	530-WFBGA, FCBGA
Supplier Device Package	530-FCBGA (16x9.5)
Number of I/O	82

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